IEEE - Institute of Electrical and Electronics Engineers, Inc. - Merging of packaging technologies for highly integrated embedded modules

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Timo Schwarz ; Hannes Stahr ; Andre Cardoso ; Elisabete Fernandes ; Aurelien Lecavelier Des Etangs-Levallois ; Michel Brizoux
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 8
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764464
Regular:

There is no doubt that component embedding technology becomes more visible in handheld applications like smart phones and wearables. Embedding technology is pushing the miniaturization which is a... View More

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