IEEE - Institute of Electrical and Electronics Engineers, Inc. - Collapse of a liquid solder bump under load1

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Author(s): Co van Veen ; Wendy Luiten
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Budapest, Hungary
Conference Date: 21 September 2016
Page(s): 34 - 38
ISBN (Electronic): 978-1-5090-5451-0
ISBN (Paper): 978-1-5090-5450-3
DOI: 10.1109/THERMINIC.2016.7748644
Regular:

In this work the collapse of a solder bump as a result of the weight load of a chip or a package is analysed. A new expression is derived for the opposing bump force that carries the load. Its... View More

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