IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel multilayer e-plane half-mode substrate integrated waveguide (HMSIW) 3-dB coupler with improved out-of-band rejection

2016 Progress in Electromagnetic Research Symposium (PIERS)

Author(s): Zhigang Zhang ; Yong Fan ; Yujian Cheng ; Yonghong Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2016
Conference Location: Shanghai, China
Conference Date: 8 August 2016
Page(s): 1,088 - 1,091
ISBN (Electronic): 978-1-5090-6093-1
DOI: 10.1109/PIERS.2016.7734586
Regular:

A novel E-plane 3 dB directional coupler with enhanced out-of-band rejection has been proposed and developed in multilayer HMSIW topology. A continuous coupling slot is etched in the conductor... View More

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