IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process development of through-glass-via (TGV) interposer for radio frequency (RF) applications

2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

Author(s): Jun Yan ; Shenglin Ma ; Feilong Ma ; Yanming Xia ; Rongfeng Luo ; Yufeng Jin ; Jing Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2016
Conference Location: Chengdu, China
Conference Date: 20 July 2016
Page(s): 1 - 4
ISBN (Electronic): 978-1-5090-2017-1
ISBN (USB): 978-1-5090-2016-4
DOI: 10.1109/IMWS-AMP.2016.7588315
Regular:

In this paper, a simplified process for TGV interposer is presented for RF applications. Sand blasting method and thinning/polishing process is utilized to form TGVs on Glass wafer. TGV interposer... View More

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