IEEE - Institute of Electrical and Electronics Engineers, Inc. - An asynchronous wafer bonding method using spot pressing technique

2016 IEEE International Nanoelectronics Conference (INEC)

Author(s): Xu Wei ; S. K. Wang ; Xu Yang ; Y. H. Wang ; D. P. Chen ; H.-G Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Chengdu, China
Conference Date: 9 May 2016
Page(s): 1 - 2
ISBN (Electronic): 978-1-4673-8969-3
ISSN (Electronic): 2159-3531
DOI: 10.1109/INEC.2016.7589314
Regular:

A novel asynchronous wafer bonding method based on Spot Pressing Bonding (SPB) using thermo-compression bonding spot by spot with Ti/Au as intermediate layer is proposed and investigated. It is... View More

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