IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation based optimization of a SMD-assembling process

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Author(s): Heinz Wohlrabe ; Harald Fritzsche ; Sebastian Lungen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Pilsen, Czech Republic
Conference Date: 18 May 2016
Page(s): 226 - 231
ISBN (Electronic): 978-1-5090-1389-0
ISSN (Electronic): 2161-2064
DOI: 10.1109/ISSE.2016.7563194
Regular:

The complete SMD-mounting process is a complex superposition of a lot of influences. There are general material (SMD-components, printed boards, solder paste, printing stencil), geometrical... View More

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