IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental study of the influence of the temperature profile on the BGA soldering

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Author(s): Karel Dusek ; Petr Vesely ; Miroslav Simek ; Alexandra Rudajevova
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Pilsen, Czech Republic
Conference Date: 18 May 2016
Page(s): 210 - 213
ISBN (Electronic): 978-1-5090-1389-0
ISSN (Electronic): 2161-2064
DOI: 10.1109/ISSE.2016.7563190
Regular:

One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the... View More

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