IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of geometry on the applied solder paste in technology Pin in Paste(PiP)

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Author(s): Valentin Tsenev ; Valentin Videkov ; Aleksei Stratev ; Mladen Mitov ; Ana Bankova ; Vasil Atanasov
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Pilsen, Czech Republic
Conference Date: 18 May 2016
Page(s): 160 - 162
ISBN (Electronic): 978-1-5090-1389-0
ISSN (Electronic): 2161-2064
DOI: 10.1109/ISSE.2016.7563180
Regular:

PiP (Pin in Paste) is a technology for soldering with the least expenses and high quality because it is carried out fast (in one step for all components) and without human intervention. In the... View More

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