IEEE - Institute of Electrical and Electronics Engineers, Inc. - Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Author(s): Marcin Mysliwiec ; Ryszard Kisiel ; Tomasz Falat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Pilsen, Czech Republic
Conference Date: 18 May 2016
Page(s): 140 - 143
ISBN (Electronic): 978-1-5090-1389-0
ISSN (Electronic): 2161-2064
DOI: 10.1109/ISSE.2016.7563176
Regular:

The aim of this work was assessment of application diffusion soldering in die attachment for the electronic devices operating at temperatures above 300 °C. Assembly process was based on the... View More

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