IEEE - Institute of Electrical and Electronics Engineers, Inc. - DSC investigation of the undercooling of SnAgCu solder alloys

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Author(s): Maik Mueller ; Alexander Turke ; Iuliana Panchenko
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Pilsen, Czech Republic
Conference Date: 18 May 2016
Page(s): 53 - 57
ISBN (Electronic): 978-1-5090-1389-0
ISSN (Electronic): 2161-2064
DOI: 10.1109/ISSE.2016.7563160
Regular:

This study investigates the undercooling of commercially available SnAgCu solder alloys by Differential Scanning Calorimetry (DSC - rate 10 K/min). The results for solder spheres of 0 260 μm... View More

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