IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal effect characterization of multiple finger power HBT: Thermal resistance matrix

2016 IEEE Information Technology, Networking, Electronic and Automation Control Conference (ITNEC)

Author(s): Chen Liang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Chongqing, China
Conference Date: 20 May 2016
Page(s): 182 - 185
ISBN (CD): 978-1-4673-9193-1
ISBN (Electronic): 978-1-4673-9194-8
DOI: 10.1109/ITNEC.2016.7560345
Regular:

The thermal resistance model of multi-finger HBTs is established, and then the expressions of self-heating thermal resistance and coupling thermal resistance are derived. Self-heating thermal... View More

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