IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal Integrity of Bump-Less High-Speed through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Author(s): Hyunsuk Lee ; Heegon Kim ; Sumin Choi ; Jaemin Lim ; Kyungjun Cho ; Yeseul Jeon ; Jongjoo Shim ; Hyungsoo Kim ; Yong-Ju Kim ; Joungho Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Las Vegas, NV, USA
Conference Date: 31 May 2016
Page(s): 2,519 - 2,522
ISBN (Electronic): 978-1-5090-1204-6
DOI: 10.1109/ECTC.2016.379
Regular:

In this paper, a bump-less high-speed through silicon via (TSV) channel is proposed for terabyte/s bandwidth 2.5D IC. The signal integrity of the proposed channel is analyzed based on the... View More

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