IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultra-Thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Author(s): Chintan Buch ; P. Markondeya Raj ; Billyde Brown ; Himani Sharma ; Teng Sun ; Kyoung-Sik Moon ; Klaus-Jurgen Wolter ; Rao Tummala ; Tadashi Takahashi ; Keiji Takemura ; Hobie Yun ; Francesco Carobolante ; Mirbozorgi Seyedabdollah ; Maysam Ghovanloo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Las Vegas, NV, USA
Conference Date: 31 May 2016
Page(s): 2,364 - 2,371
ISBN (Electronic): 978-1-5090-1204-6
DOI: 10.1109/ECTC.2016.318
Regular:

This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an... View More

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