IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Author(s): Yixiao Wang ; Xiaoxu Yang ; Ludger Overmeyer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Las Vegas, NV, USA
Conference Date: 31 May 2016
Page(s): 1,977 - 1,983
ISBN (Electronic): 978-1-5090-1204-6
DOI: 10.1109/ECTC.2016.216
Regular:

With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is... View More

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