IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design of Mechanical Properties of Transient Liquid Phase Bonds with Tertiary Metal Particles

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Author(s): Masao Noguchi ; Shailesh N. Joshi ; Ercan M. Dede
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Las Vegas, NV, USA
Conference Date: 31 May 2016
Page(s): 1,235 - 1,240
ISBN (Electronic): 978-1-5090-1204-6
DOI: 10.1109/ECTC.2016.26
Regular:

In this article, an approach is explained to controlling the Young's modulus of bonding layers formed using a Transient Liquid Phase (TLP) process. The three focus points of this research include:... View More

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