IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast and Accurate Modelling of Large TSV Arrays in 3D-ICs Using a 3D Circuit Model Validated Against Full-Wave FEM Simulations and RF Measurements

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Author(s): M. Rack ; J.-P Raskin ; X. Sun ; G. Van der Plas ; P. Absil ; E. Beyne
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Las Vegas, NV, USA
Conference Date: 31 May 2016
Page(s): 966 - 971
ISBN (Electronic): 978-1-5090-1204-6
DOI: 10.1109/ECTC.2016.227
Regular:

This paper presents a 3D circuit model capable of rapidly and accurately evaluating substrate noise coupling in the context of 3D integration. Since TSVs are large and noisy structures, the... View More

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