IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3 dimensional thermal mapping

2016 24th Signal Processing and Communication Application Conference (SIU)

Author(s): Nihal Altuntas ; Furkan Cakmak ; Erkan Uslu ; Muhammet Balcilar ; M. Fatih Amasyali ; Sirma Yavuz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Zonguldak, Turkey
Conference Date: 16 May 2016
Page(s): 1,201 - 1,204
ISBN (Electronic): 978-1-5090-1679-2
ISBN (USB): 978-1-5090-1678-5
DOI: 10.1109/SIU.2016.7495961
Regular:

3 dimensional RGB map extraction with use of registered RGB and depth data from Kinect has been widely implemented. This wide usage mostly comes from the fact that intrinsic and extrinsic... View More

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