IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling interconnects for thermoelectrically cooled infrared detectors

2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON)

Author(s): Wojciech Wiatr ; Leszek Opalski ; Jozef Piotrowski ; Mateusz Krysicki
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Krakow, Poland, Poland
Conference Date: 9 May 2016
Page(s): 1 - 4
ISBN (Electronic): 978-1-5090-2214-4
DOI: 10.1109/MIKON.2016.7491966
Regular:

We present a circuit and electromagnetic (EM) co-simulation approach to modeling interconnects of an infrared photodetector chip mounted on top of a thermoelectric cooler and cased in the TO-8... View More

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