IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimization of pre and post recipe sensitivity for unpattemed wafer defectivity inspection

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Author(s): Darryl Restaino ; Nicole Hurst ; Todd Abrams ; Alexander Parker ; Chandar Palamadai ; Mayrita Arrandale ; Shawn Macnish
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Saratoga Springs, NY, USA
Conference Date: 16 May 2016
Page(s): 206 - 211
ISBN (Electronic): 978-1-5090-0270-2
ISSN (Electronic): 2376-6697
DOI: 10.1109/ASMC.2016.7491127
Regular:

As dimensions shrink with each successive semiconductor technology node, the critical size of defects that can impact yield also shrinks. Monitoring the health of process equipment rigorously and... View More

Advertisement