IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced CMP processes for 450mm applications

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Author(s): H. M. Wang ; I. Kobata ; T. Ishibashi ; G. Stapft ; Daniel Franca
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2016
Conference Location: Saratoga Springs, NY, USA
Conference Date: 16 May 2016
Page(s): 119 - 123
ISBN (Electronic): 978-1-5090-0270-2
ISSN (Electronic): 2376-6697
DOI: 10.1109/ASMC.2016.7491125
Regular:

A 450mm CMP tool is installed, calibrated, and process qualified on oxide CMP process before the STI, W, and Cu processes can be evaluated. With the new multi-area polishing heads, the oxide... View More

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