IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel periodic mesoporous organosilica thin film with low dielectric constant and high mechanical property

2016 China Semiconductor Technology International Conference (CSTIC)

Author(s): Jiawei Zhang ; Guoping Zhang ; Rong Sun ; S. W. Ricky Lee ; C. P. Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2016
Conference Location: Shanghai, China
Conference Date: 13 March 2016
Page(s): 1 - 3
ISBN (Electronic): 978-1-4673-8804-7
ISBN (USB): 978-1-4673-8803-0
DOI: 10.1109/CSTIC.2016.7463952
Regular:

A novel organosilane precursor, (hexfluoropropane-2, 2-diyl)dibenzyl-bridged organosilane (HFPDBO) precursor, was prepared by a simple and facile synthesis. There are some... View More

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