SMTA - Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Chih Chen ; Chien-Min Liu ; Han-wen Lin ; Yi-Sa Huang ; Yi-Cheng Chu ; Dian-Rong Lyu ; Kuan-Neng Chen ; K. N. Tu
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 5
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428434
Regular:

As the size of microbumps continues to shrink, the amount of solder decreases gradually, resulting the brittleness of solder joints due to formation of intermetallic compounds. Low-temperature... View More

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