SMTA - Making the connections in electronic circuitry-the continuing evolution of joining technologies

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Tetsuro Nishimura
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 8
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428432
Regular:

The first generation of lead-free solders were very different from their tin-lead predecessor in that they were essentially a dispersion of intermetallic compounds in a pure tin matrix and the... View More

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