SMTA - Development status of photoresist as mask material for Injection Molded Solder (IMS) technique

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Koichi Hasegawa ; Jun Mukawa ; Seiichirou Takahashi ; Chihiro Kobata ; Kenzo Ohkita ; Shiro Kusumoto ; Toyohiro Aoki ; Eiji Nakamura ; Takashi Hisada ; Hiroyuki Mori ; Yasumitsu Orii
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 6
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428428
Regular:

Novel bumping technology that can realize high density assembly of IC chips and packages with a high number of I/O is required in the field of electronic packaging. Currently, the electroplating... View More

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