SMTA - Directly attached airbag sensor packaging for automobiles

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Yeong K. Kim ; Hyunjin Kang ; Joon Ki Kim
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 3
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428415

In this paper, performance of a directly attached airbag sensor for automobiles is analyzed for the signal characterization. The package was designed using the acceleration MEMS sensor on the... View More