SMTA - Effects of molding compound properties on acoustic evaluation of encapsulated microelectronic devices

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Janet E. Semmens
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 6
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428401
Regular:

A past paper discussed the trend of miniaturization in microelectronics and how this trend has driven the development of enhanced methods in acoustic micro imaging. However these methods have been... View More

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