SMTA - Improving design performance with system-level co-design and multi-physics analysis: Thermal and stress-aware design for three dimensional stacked IC package

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Author(s): Kiyohisa Hasegawa ; Kazunari Koga ; Humair Mandavia
Publisher: SMTA
Publication Date: 1 January 2016
Conference Location: Big Island, HI, USA
Conference Date: 25 January 2016
Page(s): 1 - 7
ISBN (Electronic): 978-0-9888-8739-8
ISBN (USB): 978-1-9445-4390-7
DOI: 10.1109/PanPacific.2016.7428396
Regular:

Key markets, such as automotive, wearables, and internet-of-things (IoT) are spearheading the drive to realize more sophisticated packaging technologies that include the growing use of interposers... View More

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