IEEE - Institute of Electrical and Electronics Engineers, Inc. - Plastic reshaping technique for silicon origami

2016 IEEE 29th International Conference on Micro-Electro-Mechanical Systems (MEMS)

Author(s): Takahiro Kozeki ; Shozo Inoue ; Takahiro Namazu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2016
Conference Location: Shanghai, China
Conference Date: 24 January 2016
Page(s): 455 - 457
ISBN (Electronic): 978-1-5090-1973-1
ISBN (USB): 978-1-5090-1972-4
DOI: 10.1109/MEMSYS.2016.7421659
Regular:

This paper describes Si plastic reshaping technique, Si origami, by combining focused ion beam (FIB) processing and wet etching. FIB is used as a nano tool for local etching as well as Ga ion... View More

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