IEEE - Institute of Electrical and Electronics Engineers, Inc. - 23.4 A 56Gb/s 300mW silicon-photonics transmitter in 3D-integrated PIC25G and 55nm BiCMOS technologies

2016 IEEE International Solid-State Circuits Conference (ISSCC)

Author(s): Enrico Temporiti ; Gabriele Minoia ; Matteo Repossi ; Daniele Baldi ; Andrea Ghilioni ; Francesco Svelto
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2016
Conference Location: San Francisco, CA, USA
Conference Date: 31 January 2016
Page(s): 404 - 405
ISBN (Electronic): 978-1-4673-9467-3
ISBN (Paper): 978-1-4673-9466-6
ISSN (Electronic): 2376-8606
DOI: 10.1109/ISSCC.2016.7418078
Regular:

The ever-increasing data center IP traffic, up to 8.6 zettabytes per year by 2018 with nearly 3× growth since 2013 [1], requires power-efficient high-speed interconnects. Next generation optical... View More

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