IEEE - Institute of Electrical and Electronics Engineers, Inc. - 11.2 3D ultrasonic fingerprint sensor-on-a-chip

2016 IEEE International Solid-State Circuits Conference (ISSCC)

Author(s): Hao-Yen Tang ; Yipeng Lu ; Fari Assaderagh ; Mike Daneman ; Xiaoyue Jiang ; Martin Lim ; Xi Li ; Eldwin Ng ; Utkarsh Singhal ; Julius M. Tsai ; David A. Horsley ; Bernhard E. Boser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2016
Conference Location: San Francisco, CA, USA
Conference Date: 31 January 2016
Page(s): 202 - 203
ISBN (Electronic): 978-1-4673-9467-3
ISBN (Paper): 978-1-4673-9466-6
ISSN (Electronic): 2376-8606
DOI: 10.1109/ISSCC.2016.7417977
Regular:

The increasing popularity of mobile devices such as smart phones in applications including smart payments and personal health sets a pressing need for improved security without compromised ease of... View More

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