IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal processing methods for materials defects detection

2009 IEEE International Ultrasonics Symposium

Author(s): Bouden, T. ; Dib, S. ; Aissaous, K. ; Grimes, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Rome, Italy, Italy
Conference Date: 20 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4390-1
ISBN (Paper): 978-1-4244-4389-5
ISSN (CD): 1948-5719
ISSN (Electronic): 1948-5727
ISSN (Paper): 1948-5719
DOI: 10.1109/ULTSYM.2009.5441482
Regular:

Ultrasonic Pulse Echo Technique has been used successfully as a practical modality for non-destructive testing of material to localize defects which cause critical infrastructure problems. In this... View More

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