IEEE - Institute of Electrical and Electronics Engineers, Inc. - Versatility and flexibility from low outgassing silicones

2009 11th Electronics Packaging Technology Conference (EPTC)

Author(s): Riegler, B. ; Velderrain, M. ; Lim, T.Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2009
Conference Location: Singapore, Singapore, Singapore
Conference Date: 9 December 2009
Page(s): 982 - 985
ISBN (Paper): 978-1-4244-5099-2
ISBN (Online): 978-1-4244-5100-5
DOI: 10.1109/EPTC.2009.5416401
Regular:

Silicone materials have unique characteristics allowing use in a broad range of applications and preservation of mechanical properties when exposed to extreme conditions. These mechanical... View More

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