IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on the industrial design engineering of packaging machines

2009 IEEE 10th International Conference on Computer-Aided Industrial Design & Conceptual Design (CAID&CD)

Author(s): Leming Fan ; Yang Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2009
Conference Location: Wenzhou, China, China
Conference Date: 26 November 2009
Page(s): 418 - 422
ISBN (CD): 978-1-4244-5268-2
ISBN (Paper): 978-1-4244-5266-8
DOI: 10.1109/CAIDCD.2009.5375398
Regular:

Although the quality of electromechanical products of China such as packaging machines reaches a high level, it still lags in the field of industrial design. This paper demonstrates how to carry... View More

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