IEEE - Institute of Electrical and Electronics Engineers, Inc. - Identifying Collagen Bundles in the Most Superficial Layer of Normal Articular Cartilage

2009 International Conference on Computational Intelligence and Software Engineering

Author(s): Xiaojuan Duan ; Jianping Wu ; Kirk, T.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2009
Conference Location: Wuhan, China, China
Conference Date: 11 December 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4507-3
DOI: 10.1109/CISE.2009.5365383
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