IEEE - Institute of Electrical and Electronics Engineers, Inc. - The effect of die-level stress variations on device performance

2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP)

Author(s): Owen, D.M. ; Otten, C. ; Haowen Bu ; Yun Wang ; Shetty, S. ; Hebb, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Albany, NY, USA, USA
Conference Date: 29 September 2009
Page(s): 1 - 8
ISBN (CD): 978-1-4244-3815-0
ISBN (Paper): 978-1-4244-3814-3
ISSN (Paper): 1944-0251
DOI: 10.1109/RTP.2009.5373427
Regular:

The performance improvement associated with the intentional manipulation of stresses on the transistor scale is an integral part of device fabrication at advanced technology nodes. However,... View More

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