IEEE - Institute of Electrical and Electronics Engineers, Inc. - Green future: IC packaging opportunities abound

2009 IEEE Asian Solid-State Circuits Conference (A-SSCC)

Author(s): Ho-Ming Tong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2009
Conference Location: Taipei, Taiwan, Taiwan
Conference Date: 16 November 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4434-2
ISBN (Paper): 978-1-4244-4433-5
DOI: 10.1109/ASSCC.2009.5357242
Regular:

Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves... View More

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