IEEE - Institute of Electrical and Electronics Engineers, Inc. - On the Risk of Fault Coupling over the Chip Substrate

2009 12th Euromicro Conference on Digital System Design, Architectures, Methods and Tools (DSD)

Author(s): Tummeltshammer, P. ; Steininger, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2009
Conference Location: Patras, Greece, Greece
Conference Date: 27 August 2009
Page(s): 325 - 332
ISBN (Paper): 978-0-7695-3782-5
DOI: 10.1109/DSD.2009.185
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