IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dry release of MEMS structures using reactive Ion etching technique

2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)

Author(s): Rahman, H.U. ; Ramer, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2009
Conference Location: Beijing, China, China
Conference Date: 27 October 2009
Page(s): 517 - 520
ISBN (Paper): 978-1-4244-4076-4
DOI: 10.1109/MAPE.2009.5355671
Regular:

Paper presents a dry release method for beam structures of radio frequency microelectromechanical systems (RF MEMS) switches. In this release process a combination of wet and dry etching... View More

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