IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of Logistics Financing Risk Based on the Structural Equation Modeling

2009 5th International Conference on Wireless Communications, Networking and Mobile Computing (WiCOM)

Author(s): He Juan ; Chen Xiangfeng ; Li Ming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Beijing, China, China
Conference Date: 24 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-3693-4
ISBN (Paper): 978-1-4244-3692-7
DOI: 10.1109/WICOM.2009.5301201
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