IEEE - Institute of Electrical and Electronics Engineers, Inc. - Detection of shape error through solder bump edge extraction of flip-chip by using exponential approximation function

2009 International Symposium on Optomechatronic Technologies (ISOT 2009)

Author(s): Chun-Sam Song ; Sung Man Cho ; Jong-Hyun Kim ; Joo-Hyun Kim ; Jong-Hyeong Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Istanbul, Turkey, Turkey
Conference Date: 21 September 2009
Page(s): 340 - 344
ISBN (CD): 978-1-4244-4210-2
ISBN (Paper): 978-1-4244-4209-6
DOI: 10.1109/ISOT.2009.5326039
Regular:

As the technology of semi-conductor chip progresses to pursue high density and high speed, flip-chip technology recently has played a successful role to overcome technological limit of the... View More

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