IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of compressively-strained GeOI substrates using the Smart CutTM technology

2009 IEEE International SOI Conference

Author(s): Augendre, E. ; Sanchez, L. ; Hartmann, J.-M. ; Van Den Daele, W. ; Favier, S. ; Guiot, E. ; Ghyselen, B. ; Bourdelle, K.K. ; Cristoloveanu, S. ; Billon, T. ; Clavelier, L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2009
Conference Location: Foster City, CA, USA, USA
Conference Date: 5 October 2009
Page(s): 1 - 2
ISBN (CD): 978-1-4244-5232-3
ISBN (Paper): 978-1-4244-4256-0
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.2009.5318768
Regular:

Compressively-strained Germanium-on-Insulator (c-GeOI) substrates have been fabricated using the Smart CutTM technology. The technique is based on the optimized epitaxial... View More

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