IEEE - Institute of Electrical and Electronics Engineers, Inc. - Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Milojevic, D. ; Carlson, T.E. ; Croes, K. ; Radojcic, R. ; Ragett, D.F. ; Seynhaeve, D. ; Angiolini, F. ; Van der Plas, G. ; Marchal, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306587
Regular:

New technologies for manufacturing 3D Stacked ICs offer numerous opportunities for the design of complex and effcient embedded systems. But these technologies also introduce many design options at... View More

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