IEEE - Institute of Electrical and Electronics Engineers, Inc. - The benefits of 3D networks-on-chip as shown with LDPC decoding

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Mineo, C. ; Davis, W.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 8
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306585
Regular:

In this work we describe our network-on-chip (NoC) simulator, which fills the gap between architectural level and circuit level NoC simulation. The core is a fast, high level transaction-based NoC... View More

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