IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impacts of though-DRAM vias in 3D processor-DRAM integrated systems

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Qi Wu ; Rose, K. ; Jian-Qiang Lu ; Tong Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306577
Regular:

As a promising option to address the memory wall problem, 3D processor-DRAM integration has recently received many attentions. Since DRAM tiers must be stacked between the processor tier and... View More

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