IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evolution of bond technology to hybridized process flows

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Farrens, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306576
Regular:

Wafer level bonding has emerged from the MEMS industry as a major enabling technology for 3D IC integration. The transition from a low volume MEMS manufacturing environment with many customized... View More

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