IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of 3D design choices on manufacturing cost

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Velenis, D. ; Stucchi, M. ; Marinissen, E.J. ; Swinnen, B. ; Beyne, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 5
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306575
Regular:

The available options in 3D IC design and manufacturing have different impact on the cost of a 3D System-on-Chip. Using the 3D cost model developed at IMEC, the cost of different system... View More

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