IEEE - Institute of Electrical and Electronics Engineers, Inc. - TSV metrology and inspection challenges

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Alapati, R. ; Travaly, Y. ; Van Olmen, J. ; Teixeira, R.C. ; Vaes, J. ; van Cauwenbergh, M. ; Jourdain, A. ; Verbinnen, G. ; Marcuccilli, G. ; Florence, G. ; Wolfling, S. ; Pelissier, C. ; Haiping Zhang ; Sinha, J. ; Machura, A. ; Malik, I.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306573
Regular:

The interest in 3D packaging and specifically TSV processes has grown significantly in the past few years, with nearly every major chip manufacturer announcing plans to develop and implement this... View More

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