IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D integration technology for 3D stacked retinal chip

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Kaiho, Y. ; Ohara, Y. ; Takeshita, H. ; Kiyoyama, K. ; Lee, K.W. ; Tanaka, T. ; Koyanagi, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306564
Regular:

To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector,... View More

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