IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Chen, C.L. ; Yost, D.-R. ; Knecht, J.M. ; Chapman, D.C. ; Oakley, D.C. ; Mahoney, L.J. ; Donnelly, J.P. ; Soares, A.M. ; Suntharalingam, V. ; Berger, R. ; Bolkhovsky, V. ; Hu, W. ; Wheeler, B.D. ; Keast, C.L. ; Shaver, D.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306556
Regular:

In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits. InGaAs image arrays based on... View More

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