IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wet-process deposition of TSV liner and metal films

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Truzzi, C. ; Raynal, F. ; Mevellec, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306553
Regular:

This paper describes the wet electrografting deposition of insulator, diffusion barrier and copper seed layers inside high aspect ratio Through Silicon Vias (TSVs). Basic properties of each layer... View More

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